comment on this article

ST targets price sensitive markets with new ic range

ST targets price sensitive markets with new ic range

STMicroelectronics has revealed its latest range of set top box SoC ics for hd terrestrial, cable IP and satellite equipment.

According to the semiconductor behemoth, the devices provide a platform for operators and retailers to deliver innovative internet based services in price sensitive markets.

Manufactured in 40nm process technology, ST says the heart of its new family is an enhanced processing engine with integrated on chip features. These are designed to simplify set top box design, enable operators to take advantage of lower cost memories and meet the latest low power objectives.

ST believes the chips will broaden market access to hd zappers, personal video recorders, IP clients and dual hd boxes supporting connected tv services such as Internet Protocol TV and social networking.

"Connected television is bringing today's best internet and multimedia experiences into the living room and our new family of decoders aims to make these features accessible to a much larger audience," said Laurent Remont, group vice president and general manager of ST's Connected Home Division. "This latest family of products is fully compatible among all satellite, cable, IPTV and terrestrial derivatives. In addition, the new devices build on our current, successful portfolio for entry and mid level equipment, delivering advantages such as high quality Faroudja video, 3DTV support, connectivity, and advanced security schemes with all the latest CAS support such as NSK2 or NOCS3."

ST says the new devices support the full range of hd broadcast and multimedia codecs, hybrid and IP standards, the latest security and content protection standards and middleware stacks from leading providers. The series features energy efficient Ethernet and a 0.5W standby mode with fast resume capability. Code compatible with the STi7105, the devices are designed to facilitate rapid porting of existing software.

The STiH207, STiH237, STiH239 and STiH273 are sampling now to lead customers, in 27 x 27mm BGA packages.

Chris Shaw

Comment on this article

This material is protected by Findlay Media copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

Enjoy this story? People who read this article also read...

What you think about this article:

Add your comments


Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

IoT development kit

Imagination Technologies has launched the Creator Ci40 development kit, ...

Using a new knob

The move to push semiconductor manufacturing processes to ever smaller ...

EMD Forum & Seminar

The evening will start with a short seminar of speakers from the EMD Forum and ...

Between the layers

ZofzPCB is a free 3D Gerber viewer that allows designers to see inside the ...

What’s in a name?

A month after rumours started to appear, ON Semiconductor has confirmed that it ...

Making it happen

Speaking at last week’s second annual ARM Forum at London’s Science Museum, the ...

Interesting times

It has certainly been an interesting year for chip giant Qualcomm. Revenues are ...