08 June 2009
Small form factor fpga package is auto qualified
Lattice has added a 132bga packaging option for its LatticeXP2 fpga range. Qualified for automotive use, the package will be targeted at space constrained applications such as camera modules, parking assistance systems and multimedia.
According to the company, the packaging has been fully qualified and characterised to meet the requirements of AEC-Q100. Available for the XP2-5 and XP2-8 devices, the package has a footprint of 64 mm2 and is 1.35 mm high. As such, Lattice claims, the package footprint is the smallest available for non volatile fpgas.
"[It] is a compelling solution for automotive designers who value high integration, source synchronous interfaces and low power consumption for tight form factor applications," said Sean Riley, general manager of high density solutions. "This single chip solution delivers the most fpga value in the smallest footprint available; an important requirement for most automotive systems, including cameras, engine control modules and media centres."
Author
Graham Pitcher
Supporting Information
Websites
http://www.latticesemi.com
Companies
Lattice Semiconductor UK Ltd
This material is protected by Findlay Media copyright
See Terms
and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the
sales team.