05 November 2009
Samsung makes 15µm thin dice for multidie package
Samsung Electronics has developed what it believes to be the thinnest multidie package, measuring just 0.6mm in height. Designed initially for 32Gbyte densities, the package is half the thickness of a conventional memory package with eight stacked chips.
"Thin remains the action word in today's mobile environment," said Richard Walsh, Samsung Semiconductor's associate director for memory marketing, "and we're taking a big step to make higher density memory less than half the thickness of what it was before."
The package features significantly thinner 'bare' die. It houses eight 32Gbit NAND flash chips, each made on a 30nm process. Each of these dice are just 15um thick. To put this into context, a piece of paper is about 100µm thick.
The breakthrough, says Samsung, will allow for the design of very high density solutions with the smallest of form factors and adds this is an 'extremely attractive' prospect for the mobile market.
Author
Graham Pitcher
Supporting Information
Websites
http://www.samsungsemi.eu
Companies
Samsung Electronics (UK)Ltd
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