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Qualcomm and TDK collaborate to provide cutting-edge communications technologies

Qualcomm and TDK have announced a $3billion joint venture to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more. Under the name RF360 Holdings, the joint venture will draw upon TDK’s capabilities in micro-acoustic RF filtering, packaging and module integration technologies and Qualcomm’s expertise in advanced wireless technologies to serve customers with leading-edge RF solutions into fully integrated systems.

In addition to creating RF360 Holdings, Qualcomm and TDK will expand their collaboration around key technology fields, including sensors and wireless charging.

Steve Mollenkopf, CEO of Qualcomm, said: “The joint venture’s RF filters will bolster Qualcomm RF360 front-end solutions to enable Qualcomm Technologies to deliver a truly complete solution to the ecosystem. This will enable us to expand our growth opportunity by allowing us to accelerate our strategy to provide OEMs across our business segments with fully integrated systems that will enable them to deliver at scale and on an accelerated timeframe.”

“The joint venture with Qualcomm is a win for both companies, which complement each other ideally,” said Takehiro Kamigama, President and CEO of TDK. “It was a major objective to ensure that our customers can continue to expect a seamless supply of discrete filters and duplexers, as well as modules.”

In addition to the joint venture, Qualcomm and TDK have agreed to deepen their technological cooperation to cover a range of cutting-edge technologies for next-generation mobile communications, IoT and automotive applications, including passive components, batteries, wireless charging, sensors and MEMS.

Author
Tom Austin-Morgan

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