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Power modules offer 60% smaller footprint than competing devices

Power modules offer 60% smaller footprint than competing devices
Power modules offer 60% smaller footprint than competing devices

Targeted at high efficiency appliance and light industrial applications, International Rectifier's µIPM power modules are said to set a new benchmark in device size, offering up to 60% smaller footprint than existing three phase motors control power ics.

The patent pending series comprises a range of fully integrated three phase surface mount motor control circuit solutions and is optimised for applications such as compressor drives for refrigeration, pumps for heating and water circulation, air conditioning fans, dishwashers and automation systems.

The devices utilise an innovative packaging technology which relies on pcb copper traces to dissipate heat, providing cost savings through a smaller package design and eliminating the need for an external heat sink.

"By utilising an innovative packaging solution, IR's µIPM products not only offer up to 60% smaller footprint compared to existing leading solutions but also deliver advantages in output current capability and system efficiency," said IR's Alberto Guerra. "Combined with ease of use, improved thermal performance and overall system size reduction, the µIPM family enables designers and system integrators to deliver more cost effective and advanced motor control solutions."

The µIPM series features advanced high voltage driver ics and high voltage FredFET mosfet switches specifically optimised for variable frequency drives. It is optimised to offer dc current ratings from 2 to 4A and voltages of 250 and 500V.

Author
Laura Hopperton

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