comment on this article

Plessey moves to develop monolithic microLED

Plessey Semiconductor intends to be the first to market a monolithic microLED based display fabricated using a GaN on silicon approach. 

Michael LeGoff, CEO, said: “By being the first to market with a monolithic microLED display, we will be demonstrating our expertise and the ability to access our proven turn-key solution, enabling manufacturers to ramp up the development and production of microLED displays to address emerging applications.”

One of the main challenges involved with manufacturing microLED displays using a non-monolithic approach is the placement of LED chips onto a CMOS backplane, currently achieved using pick and place equipment. This involves the individual placement of every LED on a pitch of less than 50μm, requiring new and expensive equipment that is subject to productivity issues. As the pixel density of displays increases and pitch reduces, pick and place becomes less feasible both commercially and technically.

Moving to a monolithic process removes the need for chip placement and will enable smaller and higher resolution displays for a range of applications.

Dr Keith Strickland, CTO, added: “GaN on silicon is the only technology that makes sense in terms of scalability and performance. It offers better thermal conductivity than sapphire and higher luminosity than OLED, which is why this technology is widely acknowledged to be the only one that can deliver high resolution, high luminance displays.”

Plessey has also started a programme that will see the company license its GaN on silicon expertise to microLED manufacturers.

Author
Bethan Grylls

Comment on this article


This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

What you think about this article:


Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

Update on Intel bug

According to a report on the BBC, Intel has stated that the software patches ...

Pushing the envelope

The demands of the IoT are pushing wireless MCU developers to create devices ...

The quest for power

The race is on to develop new battery chemistries and manufacturing processes – ...

Silicon stowaways

Trojans aren’t restricted to the software domain; in some instances, hardware ...

Power management IC

A power management IC, known as the ARG82800, has been launched by Allegro ...

HES conference

The High-End Sensors (HES) international conference will be held between April ...

MicroTech 2018

On April 9-10, 2018 the MicroTech exhibition will be held at the Royal Holloway ...

Get to market faster

A quick look at using Vicor's PFM and AIM in VIA packaging for your AC to Point ...

Embedding voice

As usual, the Consumer Electronics Show (CES) saw a bewildering array of smart ...

Tech trends

Last year was a busy one for technology and 2018 is unlikely to be any ...

Shaping the future

Alexander Everke, the CEO of ams, started his career in the semiconductor ...