15 June 2012 NXP launches ultra small mosfet in leadless package NXP launches ultra small mosfet in leadless package NXP Semiconductors has introduced the first ever mosfets in a 2 x 2mm low profile DFN package with tin plated, solderable side pads. The PMPB11EN and PMPB20EN 30V N channel devices have a maximum drain current of >10A and low Rds(on) values of 12 and 16.5mOhm at 10V respectively. According to NXP, their DFN packages offer the advantage of optical soldering inspection, as well as a better quality of solder connection compared to conventional leadless packages. The mosfets are also said to be thinner than most 2 x 2mm products on the market today, making them suitable for ultra small load switches, power converters and charger switches in portable applications such as smartphones and tablets. Package height is 0.6mm, which NXP says is eight times smaller than standard SO8 packages. Author Laura Hopperton Comment on this article Websites http://www.nxp.com Companies NXP Semiconductors This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.