03 February 2012
NXP announces major benchmark in miniaturisation
NXP Semiconductors has announced a breakthrough in miniaturisation with the launch of its next generation family of low VF Schottky rectifiers with a thickness of just 0.37mm and an outline of 1.6 x 0.8mm.
Targeting the mobile device market, NXP says the DFN1608D-2 (SOD1608) plastic package is the smallest on the market and is capable of carrying a current of up to 1.5A. The device has been released with a portfolio of six Schottky Barrier rectifiers: three 20V types optimised for low forward voltage and three 40V types optimised for low reverse current.
According to NXP, average forward current ranges between 0.5 and 1.5A and the devices deliver industry leading power performance due to a huge heatsink at the package bottom. The low forward voltage of the Schottky diodes is designed to reduce power consumption and thereby enable longer battery life in mobile devices. Typical applications include battery charging, display backlighting, switched mode power supply and dc/dc conversion for small portable equipment. With the 1.5A types, these can be extended to larger devices such as tablet pcs.
The rectifiers package has unique side pads which are tin plated to protect against oxidation and enabling side solderability. NXP says that unlike other leadless solutions where the soldered contacts remain hidden under the package, the side pads help avoid package tilting on the pcb, making it even flatter and maximising stack density. According to NXP, the ability to solder the package at the side also enables easy visual inspection of the contact and eliminates the need to inspect the solder contacts with expensive and complex x-ray equipment.
Dr Wolfgang Bindke, product marketing manager for diodes at NXP Semiconductors, said: "These devices are a real breakthrough in terms of both miniaturisation and current density for mobile device designers, giving them functionality options not previously available at this size. Tailored to the needs of ultra thin applications such as smartphones, we have created the flattest leadless plastic package on the market for 1A and above, with performance parameters found only in devices more than four times larger in size today. This portfolio is another great example of innovative, customer driven design from NXP."
Author
Chris Shaw
Supporting Information
Websites
http://www.nxp.com
Companies
NXP Semiconductors UK Ltd
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