comment on this article

‘Intelligent’ packaging could send you alerts when food is spoiled

‘Intelligent’ packaging could send you alerts when food is spoiled

Flexible packaging supplier Bemis has struck a deal with printed electronics manufacturer Thinfilm to develop a sensor platform for a new type of intelligent packaging.

The agreement is targeted at creating packaging that can wirelessly communicate information, such as freshness or shipping dates, via the internet of things.

"Intelligent packaging is an emerging technology with many potential intersections with Bemis' flexible packaging and pressure sensitive materials business segments," commented Henry Theisen, Bemis company president and ceo. "Our agreement with Thinfilm represents an investment in a technology that could eventually make printed electronics a component of every package we manufacture."

Under the agreement, Thinfilm will extend its time temperature sensor work to create a customisable sensor platform for Bemis to tailor to its customers' requirements. The intelligent packaging will be able to monitor and record key physical properties and environmental data in perishable products, from food to pharmaceuticals.

"These are exciting times for the printed electronics market, where innovative solutions that simply could not be manufactured before are soon to be delivered," said Thinfilm ceo Davor Sutija. "Our partnership with Bemis will lead to new categories and types of packaging that will bring intelligence to the everyday lives of millions of people worldwide."

The Bemis Intelligent Packaging Platform is expected to be commercially available in 2014.

Author
Simon Fogg

Comment on this article


This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

What you think about this article:


Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

Under exposure

Chipmakers are set to break the 10nm barrier as they move from the test-chip ...

Terminal antennas

Antenova is introducing two brand new antennas for the ISM and cellular ...

EEE Conference

The date for the 2017 Electrical and Electronic Equipment and the Environment ...

Get to market faster

A quick look at using Vicor's PFM and AIM in VIA packaging for your AC to Point ...

Finding its voice

The National Physical Laboratory (NPL) is the UK’s National Measurement ...

Broadband upgrade

BT has made an offer to the government to spend £600million to deliver 10Mbps ...

The project begins

Just over a week ago Stephen Doran took up his position as CEO of the Compound ...