11 July 2012
‘Intelligent’ packaging could send you alerts when food is spoiled
Flexible packaging supplier Bemis has struck a deal with printed electronics manufacturer Thinfilm to develop a sensor platform for a new type of intelligent packaging.
The agreement is targeted at creating packaging that can wirelessly communicate information, such as freshness or shipping dates, via the internet of things.
"Intelligent packaging is an emerging technology with many potential intersections with Bemis' flexible packaging and pressure sensitive materials business segments," commented Henry Theisen, Bemis company president and ceo. "Our agreement with Thinfilm represents an investment in a technology that could eventually make printed electronics a component of every package we manufacture."
Under the agreement, Thinfilm will extend its time temperature sensor work to create a customisable sensor platform for Bemis to tailor to its customers' requirements. The intelligent packaging will be able to monitor and record key physical properties and environmental data in perishable products, from food to pharmaceuticals.
"These are exciting times for the printed electronics market, where innovative solutions that simply could not be manufactured before are soon to be delivered," said Thinfilm ceo Davor Sutija. "Our partnership with Bemis will lead to new categories and types of packaging that will bring intelligence to the everyday lives of millions of people worldwide."
The Bemis Intelligent Packaging Platform is expected to be commercially available in 2014.
Author
Simon Fogg
Supporting Information
Websites
http://www.bemis.com
http://www.thinfilm.no/
This material is protected by Findlay Media copyright
See Terms
and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the
sales team.