12 June 2012

Next gen heterojunction solar cell achieves 22% efficiency

Kaneka and imec have created a 6in semi square heterojunction silicon solar cell with an integrated electroplated copper contact grid that is said to have a power conversion efficiency of 22.68%.

The companies claim that using electroplated copper to create the top grid electrode is more efficient and economical than silver screen printing, which often encounters problems in lowering resistivity and thinning the metal line in printed contacts.

Jef Poortmans, director of photovoltaic technologies at imec, commented: "We are excited that we could support Kaneka in developing these breakthrough results. They prove the capabilities of copper metallisation for next generation solar cells and strengthen our belief that in the future copper will play an important role in high efficiency and sustainable solar cell technology."

The companies believe the development of large area Cu plated heterojunction silicon solar cells is an important step towards a fab compatible process on large area module integrated solar cells.

Author
Simon Fogg

Supporting Information

Websites
http://www2.imec.be/

Companies
IMEC

This material is protected by Findlay Media copyright
See Terms and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the sales team.

Do you have any comments about this article?

Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

imec, Renesas collaboration

imec has teamed up with Renesas to develop ultra low power wireless ...

$5.6m PRiME project launched

Electronic engineers and computer scientists from four of the UK's leading ...

EU to compete in Si photonics

According to French research organisation CEA-Leti, the recently concluded ...

Battery revolution on the way?

Since the invention of the battery by Volta in the early days of the 19th ...

Atomic force microscopy

The microscope is one of science's oldest tools for examining nature, going ...

ASIC/SoC prototyping platforms

Time to market pressures and growing design complexity are steering SoC ...

Capactive sensing

This whitepaper looks at a number of capacitive sensing applications to ...

Altium's Innovation Station

An introduction to the Altium Innovation Station. It includes an overview of ...

Eclipse-based embedded IDE combines best of ...

Software development tools for embedded systems have evolved in an interesting ...

IBM tackles 22nm challenges

IBM has announced the semiconductor industry’s first computationally based ...

BEEAs 2013

24th October 2013, 8 Northumberland, London

AFEs for photometry

TI's AFE4400 and AFE4490 families of AFEs for photometry.

Next gen plastic electronics

A new generation of cheap, lightweight plastic electronic technology that does ...

Touch interface innovation

A new contact microphone, when connected to a system, is able to process sound ...

Top tech trends for 2013

Bee Thakore, European technical marketing manager for element14, gives an ...

Breaking the euv log jam

Lithography is probably the biggest challenge facing those developing next ...

Exploiting graphene research

Graphene is generally accepted to be the 'wonder material' in waiting; set to ...

Brent Hudson, Sagentia

Sagentia's ceo tells Graham Pitcher how the consulting company is anticipating ...

Prof Donal Bradley, Imperial

Graham Pitcher talks to a researcher who was 'there at the start' of the ...

Geoff Halls, Roke Manor

Roke Manor continues to be a world leader in communications research, but ...