comment on this article

Lasers enable assembly of ultrathin chips

Lasers enable assembly of ultrathin chips

A team of researchers has developed a laser assisted process for assembling extremely thin semiconductor chips onto rigid and flexible substrates to create conformal circuits.

According to a team from North Dakota State University Centre for Nanoscale Science and Engineering, the laser enabled advanced packaging (LEAP) process enables chips less than 50µm thick to be rapidly placed and fixed at specific locations and orientations with high precision.

The technology has the potential to enable high volume handling, placement and interconnection of miniature microelectronic components, including active and passive embedded components.

According to Aaron Reinholz, associate director for electronics technology at NDSU CNSE, pictured, the 'thermo mechanical selective laser assisted die transfer (sladt) process produces flexible electronic and photonic devices. These are conformal for different shapes and can be bent or rolled.

"The LEAP technology and SLADT process are important because they potentially enable a new class of inexpensive electronic devices by the high volume placement and interconnection of various types of ultra thin, fine pitch, active and passive circuit components," he said. "These types of components are especially of interest for flex substrate electronics, as they allow devices to bend, roll, and be manipulated into complex geometries." Such devices include garment integrated rfid tags, intelligent sensors platforms, and self adapting conformal antennas.

Author
Chris Shaw

Comment on this article


This material is protected by Findlay Media copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

Enjoy this story? People who read this article also read...

What you think about this article:


Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

3D printed memory

Taiwanese researchers have 3D printed a type of RRAM memory onto a single ...

NI Trend Watch 2014

This report from National Instruments summarises the latest trends in the ...

Capactive sensing

This whitepaper looks at a number of capacitive sensing applications to ...

BEEAs 2013

The sixth British Engineering Excellence Awards (BEEAs) will be held on 9th ...

Better batteries

For much of the last Century, battery technology didn't really need to ...

The tale of the tape

Data storage, at least at the consumer end of the scale, is dominated by flash ...