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Infineon to supply chip technology for US ePassport programme

Infineon has signed a new five year contract with the US Government Printing Office (GPO) to supply chip technology for electronic passports.

The company will be a prime contractor for the passports which include a security chip embedded in the back cover to store a citizen's credentials.

The ePassport programme is the largest in the world and Infineon has been a supplier since GPO first began producing the documents in 2005.

According to GPO, more than 80million electronic passports have been produced to date.

Simon Fogg

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