comment on this article

Infineon to supply chip technology for US ePassport programme

Infineon to supply chip technology for US ePassport programme

Infineon has signed a new five year contract with the US Government Printing Office (GPO) to supply chip technology for electronic passports.

The company will be a prime contractor for the passports which include a security chip embedded in the back cover to store a citizen's credentials.

The ePassport programme is the largest in the world and Infineon has been a supplier since GPO first began producing the documents in 2005.

According to GPO, more than 80million electronic passports have been produced to date.

Author
Simon Fogg

Comment on this article


This material is protected by Findlay Media copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

Enjoy this story? People who read this article also read...

What you think about this article:


Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

Remote management

Out of Band (OOB) remote management can help to optimise the total cost of ...

FT51 and FT90 MCUs

FTDI's focus at Embedded World was on two new families of microcontrollers, ...

Claire Jeffreys, NEW

Claire Jeffreys, events director, National Electronics Week, talks with Chris ...