14 August 2012 Infineon to supply chip technology for US ePassport programme Infineon has signed a new five year contract with the US Government Printing Office (GPO) to supply chip technology for electronic passports. The company will be a prime contractor for the passports which include a security chip embedded in the back cover to store a citizen's credentials. The ePassport programme is the largest in the world and Infineon has been a supplier since GPO first began producing the documents in 2005. According to GPO, more than 80million electronic passports have been produced to date. Author Simon Fogg Comment on this article Websites http://www.gpo.gov/http://www.infineon.com Companies Infineon Technologies This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.