14 August 2012
Infineon to supply chip technology for US ePassport programme
Infineon has signed a new five year contract with the US Government Printing Office (GPO) to supply chip technology for electronic passports.
The company will be a prime contractor for the passports which include a security chip embedded in the back cover to store a citizen's credentials.
The ePassport programme is the largest in the world and Infineon has been a supplier since GPO first began producing the documents in 2005.
According to GPO, more than 80million electronic passports have been produced to date.
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