comment on this article

Infineon to supply chip technology for US ePassport programme

Infineon has signed a new five year contract with the US Government Printing Office (GPO) to supply chip technology for electronic passports.

The company will be a prime contractor for the passports which include a security chip embedded in the back cover to store a citizen's credentials.

The ePassport programme is the largest in the world and Infineon has been a supplier since GPO first began producing the documents in 2005.

According to GPO, more than 80million electronic passports have been produced to date.

Simon Fogg

Comment on this article

This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

What you think about this article:

Add your comments


Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

Driver vision aid

RFEL has unveiled Trailblazer, a new HD-SDI and Generic Vehicle Architecture ...

Powering change

The USB port has proved to be popular. Since its first appearance in the mid ...

Flat batteries

Researchers have been searching for alternatives to the ubiquitous lithium-ion ...

Remote management

Out of Band (OOB) remote management can help to optimise the total cost of ...

Get to market faster

A quick look at using Vicor's PFM and AIM in VIA packaging for your AC to Point ...

Unboxing the FR5969

Check out what's in your FR5969 Launchpad + Booster Pack bundle kit. The board ...

Fit for service

There are some truly exciting opportunities on the horizon. Over recent years, ...

A worthy successor

The best electrolyte material for solid-state batteries has yet to be found but ...