18 May 2009 IGBT modules boast 33% more power A new generation of intelligent igbt modules from Semikron is said to offer longer service life than non sintered modules. The parts can also be used in higher temperature applications. Described as the most powerful intelligent power module on the market – and 33% more powerful than its predecessor – SKiiP4 will be used mainly in wind and solar power applications, traction systems, elevator systems and industrial drives with outputs of between 400kW and 1.8MW. This increase in power is a result of the use of an innovative pressure contact system, an improved heat sink and IGBT4, CAL4 chip technology. In addition, six parallel half bridges have been used at the upper power end, instead of four. The modules feature chips that are joined to the ceramic substrate using sintering technology. SKiiP4 will be available with blocking voltages of 1200V and 1700V in dual pack topologies with three, four or six parallel half bridges per IPM. Digital signal transmission for the switching signals is the key to ensuring a high degree of reliability and interference immunity for switching signals. Author Graham Pitcher Comment on this article Websites http://www.semikron.com Companies Semikron Ltd This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.