18 May 2009
IGBT modules boast 33% more power
A new generation of intelligent igbt modules from Semikron is said to offer longer service life than non sintered modules. The parts can also be used in higher temperature applications.
Described as the most powerful intelligent power module on the market – and 33% more powerful than its predecessor – SKiiP4 will be used mainly in wind and solar power applications, traction systems, elevator systems and industrial drives with outputs of between 400kW and 1.8MW.
This increase in power is a result of the use of an innovative pressure contact system, an improved heat sink and IGBT4, CAL4 chip technology. In addition, six parallel half bridges have been used at the upper power end, instead of four. The modules feature chips that are joined to the ceramic substrate using sintering technology.
SKiiP4 will be available with blocking voltages of 1200V and 1700V in dual pack topologies with three, four or six parallel half bridges per IPM.
Digital signal transmission for the switching signals is the key to ensuring a high degree of reliability and interference immunity for switching signals.
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