14 September 2009

Gelsinger leaves Intel after reshuffle

  • Gelsinger leaves Intel after reshuffle

Pat Gelsinger, pictured, general manager of Intel's Digital Enterprise Group, is to leave Intel as part of a raft of organisational changes. The moves are said to align the company around its core competencies: the Intel Architecture and its manufacturing skills.

All major product divisions will be consolidated into the Intel Architecture Group (IAG), which will be co-managed by Sean Maloney and Dadi Perlmutter. Maloney will be responsible for business and operations, while Perlmutter will lead product development and architecture. Alongside businesses based on the Intel architecture, the development and marketing teams will also report to the newly appointed pair.
Intel's global manufacturing organisation, the Technology and Manufacturing Group (TMG), will now report to chief administrative officer Andy Bryant.
Both moves are said to allow Intel ceo Paul Otellini to devote more of his time to corporate strategy and driving the company's growth initiatives.
Six business groups will operate under the IAG umbrella: PC Client Group; Data Center Group; Visual Computing Group; Ultra Mobility Group; Embedded and Communications Group; and Digital Home Group.

Author
Graham Pitcher

Supporting Information

Websites
http://www.intel.com

Companies
Intel Corporation (UK) Ltd

This material is protected by Findlay Media copyright
See Terms and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the sales team.

Do you have any comments about this article?

Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

 

Related Articles

Counterfeit parts on the rise

More than 12million electronic components were involved in counterfeit ...

PMIC an integration site?

Having long been one of the least heralded parts of an electronics design, the ...

US military using fake parts

A year long probe investigation by a US Senate committee has found 1800 ...

Strength in numbers

You might think that a roundtable at a meeting of the Global Semiconductor ...

Engineering Design Show 2012

The increasing imperative is for engineers to operate across a variety of ...

Match making

There has been a significant shift over the last 10 years towards combining ...

The real solution to fake parts

The high tech supply chain is more vulnerable to counterfeit components than ...

ES LIVE 2012

24 May 2012, Madejski Stadium and Conference Centre, Reading, Berkshire

Ask the Expert: Pekka Varis

How does the Keystone Network Coprocessor offload IPSec? Pekka is a visionary ...

First public demonstration of a live OpenVPX ...

Curtiss-Wright Controls Embedded Computing partnered with Hybricon to make ...

Archive: New Electronics 1972

The electronics news stories making the pages of New Electronics 40 years ago ...

CES 2012 - Intel highlights

Images: highlights from Intel's keynote at the 2012 International CES.

Positive signs for 2012

There's good news for the semiconductor industry as 2011 comes to a close, with ...

Kevin Page, md, ICS

Last year's BEEAs Grand Prix winner tells Graham Pitcher about life in a small ...

Dr Mike Short, president, IET

The IET's president tells Graham Pitcher the institution remains as relevant as ...

Martin Harris, Altium

Chris Shaw asks Martin Harris about the latest developments at Altium