23 June 2011

Elpida develops ultra thin dram memory for mobile devices

Japanese memory specialist Elpida has developed an 0.8mm thick dram package, consisting of four 2Gb ddr2 mobile dram chips.

The ultra thin package is claimed to be the smallest available and is targeted at high end smartphones and tablets. Elpida says it offers higher memory density in a smaller package.

"Given the 1mm thickness of previous four layer package on package (PoP) devices made by Elpida and competitors, customers have been using two layer 0.8mm packages," said company ceo Yoshitaka Kinoshita. "Thus, for systems that needed an 8Gb dram density at 0.8mm thickness, the solution has been two layers of 4Gb products. But now that four layers of 2Gb products increases the choices, more flexible system design is possible."

Kinoshita said the next step for the memory firm is to create an ultra thin 0.8mm PoP consisting of four layers of 4Gb products. The company plans to begin volume production of the four layer 0.8mm PoP products in Q3 this year.

Author
Laura Hopperton

Supporting Information

Websites
http://www.elpida.com/

Companies
Elpida Memory Inc

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