23 June 2011 Elpida develops ultra thin dram memory for mobile devices Japanese memory specialist Elpida has developed an 0.8mm thick dram package, consisting of four 2Gb ddr2 mobile dram chips. The ultra thin package is claimed to be the smallest available and is targeted at high end smartphones and tablets. Elpida says it offers higher memory density in a smaller package. "Given the 1mm thickness of previous four layer package on package (PoP) devices made by Elpida and competitors, customers have been using two layer 0.8mm packages," said company ceo Yoshitaka Kinoshita. "Thus, for systems that needed an 8Gb dram density at 0.8mm thickness, the solution has been two layers of 4Gb products. But now that four layers of 2Gb products increases the choices, more flexible system design is possible." Kinoshita said the next step for the memory firm is to create an ultra thin 0.8mm PoP consisting of four layers of 4Gb products. The company plans to begin volume production of the four layer 0.8mm PoP products in Q3 this year. Author Laura Hopperton Comment on this article Websites http://www.elpida.com/ Companies Elpida Memory Inc This material is protected by Findlay Media copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. Enjoy this story? People who read this article also read... NIDays 2013 NIDays is a technical conference designed specifically for ... Read Article Southern Manufacturing This year, Southern Manufacturing and Electronics is set to be ... Read Article Claire Jeffreys, NEW Claire Jeffreys, events director, National Electronics Week, ... Read Article BEEAs 2010 shortlist announced Findlay Media has announced the shortlist for the 2010 British ... Read Article What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.