10 April 2012 Copper-graphene composite could offer faster, cheaper way to cool electronic devices Researchers in the US have developed a new inexpensive method for cooling electronic devices. The technique uses a 'heat spreader' made of a copper-graphene composite, which is attached to the electronic device using an indium-graphene interface film. "Both the copper-graphene and indium-graphene have higher thermal conductivity, allowing the device to cool efficiently," explained Dr Jag Kasichainula, an associate professor of materials science and engineering at North Carolina State University and author of a paper on the research. Dr Kasichainula found that the copper-graphene film's thermal conductivity allowed it to cool approximately 25% faster than pure copper. The composite, he says, is easy to manufacture and low cost. The research has been published in the journal Metallurgical and Materials Transactions. Funding was provided by the National Science Foundation. Author Laura Hopperton Comment on this article Websites http://www.ncsu.edu/ This material is protected by Findlay Media copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. Enjoy this story? People who read this article also read... NIDays 2013 NIDays is a technical conference designed specifically for ... Read Article Southern Manufacturing This year, Southern Manufacturing and Electronics is set to be ... Read Article Microcontrollers deliver ... Microchip has launched what it describes as the 'world's lowest ... Read Article Remotely access up to 16 ... Lantronix is set to launch its latest evolution device/terminal ... Read Article What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.