10 July 2012 Copper bottomed move ‘pushes the boundaries’ of on chip interconnect technology In a move which it says 'pushes the boundaries' of interconnect technology, Applied Materials has released the Endura Amber physical vapour deposition system. Leading edge chips feature complex, multilevel networks with more than 60 miles of copper wiring and as many as 10billion vertical connections between layers. In the future, interconnect structures will be narrower and deeper, making it more difficult for conventional technologies to fill the structure completely and reliably with copper. Applied's Amber copper reflow technology uses capillary action to draw deposited copper into the smallest features. "The Endura Amber system delivers a breakthrough solution for scaling interconnects beyond the 20nm node, while maintaining good production yields," said Sundar Ramamurthy, general manager of Applied's Metal Deposition Products business unit. Author Graham Pitcher Comment on this article Websites http://www.appliedmaterials.com This material is protected by Findlay Media copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. Enjoy this story? People who read this article also read... NIDays 2013 NIDays is a technical conference designed specifically for ... Read Article Southern Manufacturing This year, Southern Manufacturing and Electronics is set to be ... Read Article Remotely access up to 16 ... Lantronix is set to launch its latest evolution device/terminal ... Read Article Microcontrollers deliver ... Microchip has launched what it describes as the 'world's lowest ... Read Article What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.