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CES 2020 - Siemens and Arm announce new partnership

Siemens Digital Industries Software is partnering with Arm to bring leading edge IP, methodologies, processes and tools together to help automakers, integrators and suppliers deliver next-generation platforms much faster.

The partnership looks to address the complex challenges facing the industry in developing platforms to realize active-safety, advanced driver assistance, in-vehicle infotainment, digital cockpits, vehicle-to-vehicle/vehicle-to-infrastructure and self-driving vehicles.

Key advances in computing and sensor technology are enabling companies to redefine mobility beginning with the integrated circuits and software within automotive electronics systems. The combination of Siemens’ and Arm’s technologies will look to help automakers and suppliers deliver advanced electronic design and automotive solutions.

Siemens’ PAVE360 digital twin environment, featuring Arm IP, applies high-fidelity modelling techniques from sensors and ICs to vehicle dynamics and the environment within which a vehicle operates.

Using Arm IP, including Arm Automotive Enhanced (AE) products with functional safety support, digital twin models can run entire software stacks providing early metrics of power and performance while operating in the context of a high-fidelity model of the vehicle and its environment, helping deliver a new future of mobility.

“Developing future transportation solutions requires collaboration across complex ecosystems,” said Dipti Vachani, senior vice president and general manager, Automotive and IoT Line of Business, Arm. “Arm technology has been deployed in applications across the whole vehicle for more than two decades, and our collaboration with Siemens redefines what is possible in terms of safety-capable, scalable heterogeneous compute. We see this as an important catalyst for the next wave of automotive semiconductor innovation.”

Using Siemens’ PAVE360 with Arm automotive IP, automakers and suppliers can simulate and verify sub-system and system on chip (SoC) designs, and better understand how they perform within a vehicle design from the silicon level up, long before the vehicle is built.

“In all we do at Siemens, our goal is to provide transportation companies and suppliers the most comprehensive digital twin solutions, from the design and development of semiconductors, to advanced manufacturing and deployment of vehicles and services within cities,” said Tony Hemmelgarn, president and CEO at Siemens Digital Industries Software. “Siemens believes collaboration with Arm is a win for the entire industry. Carmakers, their suppliers, and IC design companies all can benefit from the collaboration, new methodologies and insight now sparking new innovations.”


Author
Neil Tyler

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