comment on this article

Bosch to build 12in fab in Dresden

Bosch is making what is said to be the largest investment in its 130 year history with the building of a 12in fab in Dresden to make chips for mobility and IoT applications.

Dr Volkmar Denner, chairman of Robert Bosch , said: “Semiconductors are the core components of all electronic systems. With connectivity and automation growing, they are being used in more and more areas of application. By extending our semiconductor manufacturing capacity, we are giving ourselves a sound basis for the future and strengthening our competitiveness.”

Construction of the plant, which will involve an investment of around €1billion, is scheduled for completion by the end of 2019, with manufacturing likely start at the end of 2021.

Bosch has been making chips for 45 years and its Reutlingen fab currently produces 1.5million ASICs and 4m MEMS sensors a day on 6 and 8in wafers. Its semiconductor portfolio includes acceleration, yaw, mass-flow, pressure, and environmental sensors, as well as microphones, power semiconductors, and ASICs for vehicle ECUs.

Author
Graham Pitcher

Comment on this article


Companies

Bosch Ltd

This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

What you think about this article:


Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

EEE Conference

The date for the 2017 Electrical and Electronic Equipment and the Environment ...

Get to market faster

A quick look at using Vicor's PFM and AIM in VIA packaging for your AC to Point ...

Mobile slowdown

With just under a week to go before Apple launches its new iPhone the press has ...