comment on this article

Benchmark shows ‘huge MCU efficiency differences’

Benchmarking consortium EEMBC has launched ULPMark-PeripheralProfile (ULPMark-PP), a tool intended to measure the energy efficiency of MCUs and commonly used programmable peripherals. According to the group, ULPMark-PP reveals how efficiently each MCU vendor has designed and implemented its integrated peripherals.

Simultaneously, EEMBC is publishing the first ULPMark-PP results to demonstrate the benchmark’s value. According to EEMBC president Markus Levy, pictured, the results demonstrate ‘huge efficiency differences between microcontrollers’.

“Because every application has different needs to optimise power, performance, and cost, providing valuable and relevant microcontroller benchmarks requires ‘peeling the onion’ to understand which MCU is best for each application, said Mark Wallis, co-chair of the EEMBC IoT working group and system architect at STMicroelectronics.

The ULPMark-PP supplements EEMBC’s ULPMark-CoreProfile (ULPMark-CP) benchmark, which measures the efficiency of the MCU’s core by waking up every second to perform a brief CPU task before returning to an ultra-low-power mode. The ULPMark benchmarks are supplemented by IoTMark-BLE, which measures the energy used by the full subsystem, including the MCU, the radio and the protocol stack.

Levy concluded: “I encourage all embedded system developers to encourage their MCU vendors to publish the results for their devices. A comprehensive table of ULPMark-PP results adds credibility and realworld comparability to the specifications in datasheets.”

Meanwhile, EEMBC is planning to launch SecureMark, a security benchmark that mimics a typical TLS ciphersuite, as used by modern IoT devices, using basic security primitives like elliptic curve cryptography and AES.

  • For more on EEMBC's 20 years of benchmarking, click here

Author
Graham Pitcher

Comment on this article


This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

What you think about this article:


Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

Graphene scaffold

While lithium metal-based batteries are attractive in theory, practical ...

Driving innovation

Oxford University has a reputation not only as an internationally recognised ...

Careless whispers

Chris Edwards explores how timing, EMI and even sound can provide attackers ...

Power management IC

A power management IC, known as the ARG82800, has been launched by Allegro ...

HES conference

The High-End Sensors (HES) international conference will be held between April ...

MicroTech 2018

On April 9-10, 2018 the MicroTech exhibition will be held at the Royal Holloway ...

Get to market faster

A quick look at using Vicor's PFM and AIM in VIA packaging for your AC to Point ...

Tech trends

Last year was a busy one for technology and 2018 is unlikely to be any ...

Shaping the future

Alexander Everke, the CEO of ams, started his career in the semiconductor ...