26 January 2012 Automotive electronics packaging raises bar, claims Infineon Automotive electronics packaging raises bar, claims Infineon Infineon Technologies has unveiled an innovative package technology that it claims sets a new standard for high current capability and high efficiency for automotive electronics applications. Suitable for electric and hybrid vehicles, the TO package is compliant with JEDEC standard Heatsink Plastic Small Outline Flat lead (H-PSOF). The first products using the H-PDSOF package technology are 40V OptiMOS T2 power transistors, offering up to 300A current capability and ultra low RDS(ON) values of 0.76m?. Higher performance power electronics components help automotive system designers comply with government regulations mandating higher standards for automotive fuel efficiency while also demanding lower overall emissions. To meet these standards, power mosfets with current capability above 200A and R DS(on) below 1m? are needed to reduce conduction losses and improve overall efficiency. According to Infineon, mosfets to fulfil these needs have not yet been available in the automotive market. With the introduction of the H-PSOF package, Infineon says it defines a new milestone providing 40V power mosfets with up to 300A current capability and RDS(ON) of 0.76m?. The overall dimensions and the height of the H-PSOF package were reduced compared to a standard D 2PAK package (TO-263) which is typically used in these types of applications. According to Infineon, the footprint of the H-PSOF package is about 20% smaller and its height is almost half that of the current D 2PAK package. The H-PSOF package is designed to enable automotive electronics manufacturers to better serve the market for high current applications. These include applications such as battery management for hybrid vehicles as well as Electric Power Steering (EPS), active alternators and other heavy load applications enabling higher efficiency and lower emissions. Infineon says the main goal for the development of the H-PSOF package was to decrease the package resistance and increase the current capability of the package compared to the D 2PAK offering high current capabilities. The first available product using Infineon's new package is the IPLU300N04S4-R7, a member of the 40V OptiMOS T2 automotive power transistor family. caption: The automotive package H-PSOF was developed for high current applications such as battery management for electric and hybrid vehicles, EPS and active alternators Author Chris Shaw Comment on this article Websites http://www.infineon.com/automotive Companies Infineon Technologies This material is protected by Findlay Media copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team. Enjoy this story? People who read this article also read... NIDays 2013 NIDays is a technical conference designed specifically for ... Read Article Southern Manufacturing This year, Southern Manufacturing and Electronics is set to be ... Read Article Remotely access up to 16 ... Lantronix is set to launch its latest evolution device/terminal ... Read Article Microcontrollers deliver ... Microchip has launched what it describes as the 'world's lowest ... Read Article What you think about this article: Add your comments Name Email Comments Your comments/feedback may be edited prior to publishing. Not all entries will be published. Please view our Terms and Conditions before leaving a comment.