29 June 2012
ARM, HP and SK hynix join Hybrid Memory Cube consortium
The Hybrid Memory Cube Consortium (HMCC) has announced that ARM, HP, and SK hynix have joined its global effort to accelerate widespread industry adoption of hybrid memory cube (HMC) technology.
The HMCC is a collaboration of oems, enablers and integrators who are cooperating to develop and implement an open interface standard for this new memory technology. Initial developing members Micron and Samsung are working with Altera, IBM, Microsoft, Open Silicon and Xilinx to draft an industry wide specification that aims to pave the way for a wide range of electronic advances.
"The strong collection of companies who have joined the consortium – representing a broad range of technology interests – reflects the perceived high value of HMC as the next standard for high performance memory applications," commented Robert Feurle, Micron's vp for dram marketing. "With the addition of ARM, HP and SK hynix as developers, who will help to determine the specific features, the consortium is well positioned to provide a new open standard for next gen electronics."
A key motivation for forming the HMCC was that the memory bandwidth required by high next generation equipment has increased beyond what conventional memory architectures can provide. HMC technology could break through this 'memory wall' and offer increased density and bandwidth with significantly lower power consumption.
Hewlett Packard Ltd
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