comment on this article

28nm collaboration accelerates turnaround for soft modem chipsets

Soft modem chipset specialist Icera and Magma Design Automation, a provider of chip design software have announced the joint development of Icera's 28nm SoC design flow for its next generation chipsets.

Bristol based Icera selected Magma's Talus 1.2 platform with OCV and clock gating capabiliyies to provide an integrated flow that enables it to address 28nm design complexity. According to the company it will also improve area efficiency and reduce power consumption while accelerating turnaround time.

Peter Hughes, pictured, vice president of Silicon Engineering and Operations at Icera, said: "The advanced technology and tight integration of the Talus platform enable Icera to meet our stringent power and area targets and to reduce time to market for our next generation 28nm soft modem chipset."

Premal Buch, general manager of Magma's Design Implementation Business Unit, added: "The recent enhancements to the Talus platform were developed specifically to address increasing design complexity at the 28nm node while improving designer productivity dramatically. Offering the capacity to process 1million cells per day, integrating the Tekton based MX timing engine to ensure correlation and accelerate timing closure, and supporting advanced low-power design techniques, Talus is the clear path to 28nm and smaller SoCs."

Author
Chris Shaw

Comment on this article


This material is protected by MA Business copyright See Terms and Conditions. One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.

What you think about this article:


Add your comments

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Related Articles

M2.COM selects LoRa

The M2.COM sensor platform, announced by Advantech in February 2016, will use ...

MISRA C evolves

With the increased connectivity of applications and devices, OEMS are demanding ...

Material challenges

In 2015 the global installed capacity for photovoltaics hit 180GW and the ...

Get to market faster

A quick look at using Vicor's PFM and AIM in VIA packaging for your AC to Point ...

The great debate

According to Mark Twain: “Facts are stubborn things, but statistics are ...

Intel looks to IoT

Intel has built its business on domination of the PC market. Over the years, ...

Hardware development

In today’s fast-paced, connected world, the need for more capable and adaptable ...

Keeping standards high

Engineers – at least those who are worth their salt – ask questions. And those ...