Click here

Page 226 of 312 « 224 225 226 227 228 Electronics News

Embedded Linux community unveiled 04/03/2009

Embedded World 2009 is the launchpad for a unique online community site for developers of embedded Linux devices.  Read More

Emerson uses Atom to address broader market 04/03/2009

Emerson Network Power is embarking on a new strategy under which it aims to become the supplier of choice for industrial and commercial OEMs.  Read More

Lower current, higher memory 04/03/2009

Jennic has launched its latest single chip 32bit wireless microcontroller which it claims has the lowest system operating current and highest memory density.  Read More

Building blocks of education 04/03/2009

Students can take advantage of IAR Systems’ free embedded workbench development environment for Lego’s robotic building system.  Read More

Module endures extreme temperature ranges 03/03/2009

As an enhancement to its existing Com Express range, Congatec has announced the launch of conga-Cax, an industrial grade module based on the Intel Atom processor Z5xx series.  Read More

Kontron pushes COM standard 03/03/2009

Kontron, Advantech, Aaeon and Adlink announced at Embedded World in Nuremberg today that they will present the nanoETXexpress form factor to the PICMG consortium for potential incorporation into the next COM Express releases.  Read More

Expanded partner programme for Microsoft 03/03/2009

Microsoft has announced the latest developments in its automotive business and an expanded partner programme at Embedded World 2009.  Read More

Low power board launched at Nuremberg 03/03/2009

Embedded World 2009, now well underway, has been the launchpad for Eurotech’s new low power board, designed for rugged applications.  Read More

Mobile phone technology goes into car safety 03/03/2009

Fujitsu Microelectronics Europe has just signed a licensing agreement for the ARM Cortex R4F processor for use in automotive applications that include safety and chassis.  Read More

Intel, TSMC collaborate on Atom 02/03/2009

Intel and TSMC have signed a Memorandum Of Understanding under which they will collaborate on technology platform, IP infrastructure, and SoC solutions. Under the terms of the agreement, Intel will port its Atom processor cpu cores to the TSMC technology platform including processes, IP, libraries, and design flows.  Read More

Brooks to head Avnet Embedded EMEA 02/03/2009

Avnet Embedded has appointed Martin Brooks as vice president of Avnet Embedded. Brooks, who joined Avnet following the acquisition of Abacus, will be responsible for defining and executing the company’s embedded strategy.  Read More

Bringing lte to life in Japan 02/03/2009

The completion of the first commercial long term evolution (lte) system network by the end of 2009, is under way in Japan.  Read More

New president for Sony 02/03/2009

Sony chairman and ceo Sir Howard Stringer is to assume the role of president, sidelining current president Ryoji Chubachi to vice chairman.  Read More

Intel invests €50million in Ireland 02/03/2009

According to IDA Ireland, Intel will invest more than €50 million in a major expansion at its R&D facility in the Shannon Free Zone. The investment could create up to 134 jobs over the next four years, bringing the total employment to approximately 300.  Read More

Acquisition enables commercialisation of metering comms products 26/02/2009

Analog Devices (ADI) has acquired the PowerBus Rhino power line communications technology from Domosys – a privately held company based in Canada.  Read More

Agreement signed to support wireline networking standard 26/02/2009

The Universal Powerline Association (UPA) and the HomeGrid Forum have signed an agreement for cooperative joint research, development and commercialisation of networking technologies.  Read More

Ailing flash maker to axe 3000 jobs 25/02/2009

Just a few weeks after the appointment of a new chief executive, flash memory specialist Spansion has announced that it is to lay off 3000 employees – equivalent to 35% of its workforce.  Read More

Multiple users – same audio stream 23/02/2009

A new Bluetooth application allows multiple users to listen to the same audio stream on different headsets connected to a mobile device.  Read More

Ramtron signs up with IBM 23/02/2009

FRAM developer Ramtron has signed a foundry services agreement with IBM.  Read More

FPGAs for cost sensitive applications 23/02/2009

Looking to meet the needs of cost sensitive, mid performance applications, Lattice Semiconductor has the LatticeECP3 family.  Read More

ARM core is no bigger than grain of sand 23/02/2009

ARM has unveiled its smallest processor core yet. The 32bit Cortex-M0 device not only occupies around 12,000 gates, but also records power consumption levels of 85µW/MHz on a 0.18µm process.  Read More
Image 2 comments

EMS sector expects ‘rough ride’ 22/02/2009

The UK’s electronic manufacturing services (EMS) sector is expecting a rough ride going into Q2 of 2009, according to a survey conducted by trade association Intellect.  Read More

CSR targets connectivity 21/02/2009

In a move to help product developers create modules which address connectivity issues, CSR has launched the CSR9000.  Read More

Medical market targeted 20/02/2009

LynuxWorks has announced that its LynxSecure 2.0 separation kernel and embedded hypervisor is now available for use on Intel’s Core 2 Duo processor range.  Read More

All done by mirrors 20/02/2009

As populated pcbs become more complex, inspection of solder joints and components concealed by others becomes more of a challenge.  Read More

Page 226 of 312 « 224 225 226 227 228

Editor's Choice

Sensor market back on track

Emerging markets such as the Internet of Things, wearable electronics and the ...

Electronics dissolve on cue

Researchers at Iowa State University are the latest to shift their focus to the ...

Inspiring a generation

The UK's future engineers and inventors gathered at London's Science Museum ...