Page 2 of 233 «« 1 2 3 4 5 »»» Electronics News

Four channel a/d converter features ‘industry’s lowest power and package size’ 17/05/2012

Analog Devices has introduced a new four channel high speed a/d converter for medical imaging and communications applications.  Read More

FTDI signs global distribution deal with Arrow 17/05/2012

USB specialist Future Technology Devices International (FTDI) has signed a deal with Arrow Electronics to distribute its complete portfolio to customers in the Americas, EMEA and Asia Pacific regions.  Read More

Nvidia chip to power world’s top supercomputers 16/05/2012

Nvidia has unveiled a new family of Tesla gpus built to handle the most complex high performance computing problems.  Read More

JLR joins UKESF in bid to retain UK’s young engineering talent 16/05/2012

Jaguar Land Rover (JLR) has pledged its support to the UK Electronic Skills Foundation (UKESF), which seeks to reverse the UK's significant decline in electronic engineering graduates by raising the industry's profile among young people.  Read More

Plextek, RedCloud complete acquisition of Iceni Mobile 16/05/2012

Plextek and RedCloud have completed the acquisition of Iceni Mobile, an Essex based company best known for its innovative I2S mobile payments system. The companies plan to use the technology to create a new way in which mobile money and associated services are taken to market.  Read More

Researchers harness engineered viruses to produce electrical energy 16/05/2012

Researchers from the US Department of Energy's Lawrence Berkeley National Laboratory have found a way to generate power using harmless viruses that convert mechanical energy into electricity.  Read More

Cadence upgrades verification software 15/05/2012

Cadence Design Systems has unveiled a new in circuit acceleration approach for its System Development Suite. Based on its Incisive and Palladium XP platforms and featuring extensions to the Verification IP (VIP) Catalog, the upgrades are said to give engineers the ability to speed the verification of large scale SoCs, subsystems and systems.  Read More

HP opens technology renewal centre to target e-waste 15/05/2012

HP has announced the opening of a technology renewal centre in Scotland to help combat the problem of electronic waste.  Read More

AMD’s Trinity chipsets to rival Ivy Bridge? 15/05/2012

AMD has launched the Trinity family of accelerated processing units (APUs), targeted at improved multimedia experiences in oem notebooks, ultrathins, all in ones and desktops.  Read More

Hybrid copolymer films could pave way for next gen flexible electronics 15/05/2012

Researchers have developed new thin films based on hybrid copolymers which could increase the capacity of hard discs and the speed of microprocessors, as well as aid the development of next generation flexible electronics.  Read More

Intel adds to Xeon lineup 15/05/2012

Intel has unveiled a host of new Xeon processors, including the first ever server chips based on its 22nm Ivy Bridge architecture.  Read More

IHS: Mobile memory chip market growth to be propelled by smartphones and tablets 15/05/2012

Smartphones and tablets will act as catalysts for continued growth of the mobile memory semiconductor market, according to an IHS iSuppli report.  Read More

MIPS unveils three cores in new microprocessor range 14/05/2012

Microprocessor core developer MIPS Technologies has launched the Aptiv Generation range, featuring three core families which offer performance levels to address the company's target markets.  Read More

CMOS image sensor market regains growth momentum 14/05/2012

A new wave of portable camera products is driving a revived sales growth in CMOS image sensors, according a report by IC Insights.  Read More

Infineon ceo to quit at end of September 14/05/2012

Infineon's ceo Peter Bauer, pictured left, has announced that he will resign at the end of September due to health reasons. Bauer began his career in 1985 at Siemens Semiconductors, which span out into Infineon Technologies. He was part of the Infineon's management board when it went public in 2000 and became ceo in 2008.  Read More

Texas Instruments tops 2011 MEMS leader board 11/05/2012

Texas Instruments has retained its spot as the world's number one MEMS manufacturer after fending off competition from the likes of HP and STMicroelectronics.  Read More

Peratech creates innovative ‘electronic nose’ using QTC technology 11/05/2012

UK firm Peratech has created an 'electronic nose' that detects the presence of volatile organic compounds (VOCs) and could integrate into paper or clothing to alert a user to the presence of harmful gases.  Read More

32bit automotive mcus meet powertrain and safety requirements 11/05/2012

A new family of 32bit microcontrollers designed to meet the requirements of powertrain and safety applications in the automotive industry has been announced by Infineon.  Read More

Samsung, Qualcomm form wireless power alliance 10/05/2012

Samsung Electronics and Qualcomm have joined forces with five other technology firms to form the Alliance for Wireless Power (A4WP).  Read More

XP Power unveils 95% efficient 250W convection cooled power supplies 10/05/2012

XP Power has announced the CCB250 series of single output 250W ac/dc power supplies, which it claims has an operating efficiency of up to 95%.  Read More

Isolated half bridge gate drivers are ‘industry’s fastest and most reliable’ 09/05/2012

Analog Devices has launched what it claims are the industry's fastest and most reliable isolated half bridge gate drivers with 4X faster timing and a 50 year operating life.  Read More

Power modules offer 60% smaller footprint than competing devices 09/05/2012

Targeted at high efficiency appliance and light industrial applications, International Rectifier's µIPM power modules are said to set a new benchmark in device size, offering up to 60% smaller footprint than existing three phase motors control power ics.  Read More

Intersil unveils next gen 40nm Thunderbolt solution 09/05/2012

Intersil has unveiled a new active cable solution specifically designed to support Thunderbolt cables. Said to offer unmatched performance and cost effectiveness, the module includes the ISL37231 – the industry's first 40nm active cable ic – and the ISL80083 companion power management ic.  Read More

IDT unveils ‘world’s first’ piezoelectric MEMS oscillators 09/05/2012

IDT has launched what it claims to be the world's first crystal free piezoelectric MEMS (pMEMS) oscillators for high performance communications, consumer, cloud and industrial applications.  Read More

Micron to begin volume production of ddr4 dram this year 08/05/2012

Micron Technology has announced that production of its first fully functional ddr4 dram module is planned for Q4 2012 after sampling to key partners began earlier this year.  Read More

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