More than a third of UK manufacturing companies believe young people don't have the work ethic to succeed in industry, according to a poll released today by the Institution of Mechanical Engineers (IMechE).
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In a seven year partnership designed to cover the whole electronics value and innovation chain, the European Commission is hoping to invest up to €100billion in an attempt to make Europe more competitive in the global market. The money is likely to come from private, regional, national and EU funds.
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Measuring just 3 x 3 mm, the Si52111 and Si52112 from Silicon Labs are said to be the smallest and lowest power PCIe clock generators on the market.
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TI's new brushless dc motor driver, the DRV10963, is designed to reduce board space by 80% and extend battery life by 25%.
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LG Electronics has licensed ARM's Cortex-A50 family of cpus, as well as its next generation Mali-T604 gpus.
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ARM's retiring ceo, Warren East, has become a non executive director of The Connected Digital Economy Catapult (CDEC).
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Total worldwide shipments of solid state drives (SSDs) are expected to increase by 300% over the next four years, according to IHS iSuppli.
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A new type of wearable sensor has been developed that could greatly improve the accuracy and practicality of heart monitoring.
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STMicroelectronics' new STripFET VII DeepGATE mosfets are designed to deliver the best possible conducting efficiency among 80 and 100V devices, while also reducing switching efficiency.
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Roke Manor Research has developed a self charging miniaturised device which generates a radio signal that can be tracked over distances of up to 200km.
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AMD's share of microprocessor sales fell to 6.4% in 2012, compared to 8.2% in 2011 and 9.6% in 2010.
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There are many applications in which motion detection is an important element, including robotics, home automation, surveillance and medical instrumentation. However, while the single lens eyes currently used provide better resolution, they lack a suitable field of view.
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In its latest Market Insight report, Gartner says the delay in developing extreme ultraviolet lithography (euv) technology will result in significantly higher lithography costs. While it acknowledges that other technologies have the potential to minimise the higher costs, they are still several years away.
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Northwestern University researchers have found a way to print highly conductive, bendable layers of graphene – a breakthrough which they claim could pave the way toward low cost, foldable electronics.
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imec and Globalfoundries are increasing their joint development efforts to advance spin transfer torque magnetoresistive ram (stt-mram) technology.
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Looking to help developers jumpstart their product designs, Texas Instruments has introduced a new processor based evaluation module for industrial applications.
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Toshiba is to apply its second generation 19nm process technology to a new range of 2bit per cell 64Gbit nand flash chips.
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Looking to break into the booming wireless market, Dialog Semiconductor has introduced what it says is the industry's smallest and lowest power Bluetooth SoC.
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Researchers in the US have identified a new security risk in the sensors of implantable medical devices such as defibrillators and pacemakers.
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Cambridge Nanotherm is to build its first prototype manufacturing plant in the UK, following a £250,000 grant from the Technology Strategy Board (TSB).
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Researchers from the Fraunhofer Institute for Applied Solid State Physics and the Karlsruhe Institute for Technology have transmitted data wirelessly at 40Gbit/s over a distance of 1km using a carrier frequency of 240GHz.
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Intel is partnering with Swiss manufacturer u-blox to bring to market a 3G only HSPA module.
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imec has teamed up with Renesas to develop ultra low power wireless technologies for short range communication devices.
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Semiconductor sales in the first quarter of this year were up 16% on Q4, according to the latest figures from DMASS (Distributors' and Manufacturers' Association of Semiconductor Specialists).
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Sheffield based firm sureCore has secured a Technology Strategy Board SMART award of £250K to help realise its low power SRAM technology in a next generation silicon process node.
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