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Renesas adds 20 MCUs to Synergy platform

Renesas has added the S128, S3A3, and S3A6 MCU families to its Synergy platform, enabling engineers to select from 57 devices in seven MCU groups. The newly added ARM Cortex-M based parts run at frequencies ranging from 32MHz to 240MHz and offer flash memories ranging from 64kbyte to 4Mbyte.

Peter Carbone, vice president of Renesas’ Synergy IoT Platform Business Division, said: “With the addition of these three MCU groups, the Synergy Platform now covers the ...

Lithium ion theory to be revised

The ultrafast dynamics of lithium ions have been observed in real-time with femtosecond time resolution by researchers from the Centre for Molecular Spectroscopy and Dynamics, within Korea’s Institute for Basic Science.

Intel fellow calls for standardised density metric

Speaking at Intel’s Technology and Manufacturing Day in San Francisco, the company’s senior fellow and director of process architecture and integration, Mark Bohr, called for a standardised density metric to be used to indicate how one particular process relates to another.

High voltage MOSFET improves efficiency in power applications

Infineon Technologies has added the 600V CoolMOS P7 and 600V CoolMOS C7 Gold product families to its MOSFET portfolio. The parts are designed to operate at 600V breakdown voltage and to deliver improved superjunction MOSFET performance. Both families are said to achieve unmatched power density in their target applications.

UPDATE - Intel unveils 3D XPoint based SSDs

It’s getting on for two years since Intel and Micron launched their 3D XPoint memory concept. Describing the approach as ‘the first new class of mainstream memory technology since 1989’, they claimed 3D XPoint would be ‘up to 1000 times faster than NAND flash’. Since then, the performance claims have been scaled back significantly.

EU investing €15.5million in photonic IC technology

Looking to provide Europe with a state-of-the-art infrastructure to support the development and manufacture of photonic integrated circuits (PICs), the EU is investing €15.5million in an international consortium called PIXAPP, which will be led by Ireland’s Tyndall National Institute.

Embedded World: an overview

Mouser and Renesas announced a global distribution partnership at Embedded World. Together, the companies will focus on the latest software, development kits and MCUs that comprise the Synergy Platform “We have planned to work closely with Renesas,” said Mark Burr-Lonnon, senior vice president, EMEA and Asia, at Mouser. “But we’ve decided to focus initially on helping to launch the Renesas Synergy Platform.”

A big leap toward tinier lines

A team of researchers at MIT and the University of Chicago claim to have found a way to produce some of the narrowest wires yet, using a process that could be scaled up for mass manufacturing.

EPSRC provides £20million for high performance computing

The Engineering and Physical Sciences Research Council (EPSRC) is providing £20million to fund establishment or expansion of six high performance computing (HPC) centres. The investment is intended to provide academics and industry with access to support research in engineering and the physical sciences.

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