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International Conference and Exhibition on Device Packaging – Arizona

Courtesy of US Army RDEDCOM AMRDEC

On March 5-8, 2018, the 14th International Conference and Exhibition on Device Packaging will be held in Fountain Hills, Arizona.

The organisers state that the event is a ‘major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields’. IMAPS hope the conference will attract a diverse group within the industry and academia.

The three topical workshop tracks that will feature include:

  • Interposers and 3D IC and packaging
  • Flip chip, wafer level packaging and fan-out
  • Engineered micro systems/devices (including MEMS, sensors and 3D printing)

There will be an array of half-day courses available on March 6, preceding the technical conference.

Conference and technical workshops
March 6-8, 2018

Exhibition and technology showcase
March 6-7, 2018

Professional development courses
March 5, 2018

GBC plenary session
March 7, 2018

Contributor
IMAPS

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