All Distribution News

Arrow and Novasom sign EMEA distribution agreement

Arrow Electronics has confirmed a new distribution agreement with Novasom Industries, a global engineering company that develops advanced technology solutions for products and processes in the fields of embedded electronics. The agreement will cover the entire EMEA region.

Semiconductor distribution market slows in second quarter

Growth rate for European semiconductor distribution slowed down through Spring quarter. According to Distributors’ and Manufacturers’ Association of Semiconductor Specialists (DMASS), sales in the second quarter grew by 2.15% to €1.86billion over the same quarter last year.

Smiths Connectors and TTI sign an agreement

Following a distribution agreement, TTI can now offer Smiths Connectors’ interconnection product range across Europe. The agreement builds on a partnership between Smiths Connectors and Mateleco, the French specialist connector distributor acquired by TTI, and completes the business relationship already existing with TTI in the US.

Avnet outbids Datwyler to acquire Premier Farnell

Avnet says it has reached agreement with the Premier Farnell’s directors to acquire the company in an all cash offer which values the distributor at £691million. This is said to be a 12.1% premium over the offer from Datwyler, which was initially accepted by Premier Farnell’s board.

Stadium unifies power brands

Stadium Group has brought its Stadium Power and Stontronics brands together as one trading entity called Stadium Stontronics. The move is said by the company to give its customers access to a wider range of standard, custom and semi custom power supplies, with support from Regional Fulfilment Centres in Reading and Hong Kong and Regional Design Centres in Norwich and Shanghai.

FEEU signs exclusive distribution deal with Ambiq

Fujitsu Electronics Europe has added MCUs and real time clocks from Ambiq Micro to its portfolio. As part of the agreement, the company will become the exclusive distributor of Ambiq Micro products in Europe, following a transition period.

Councils not on track for smart city delivery

New research, commissioned by street lighting experts Lucy Zodion and conducted by independent research agency, DJS Research, has highlighted the risk that many local governments are lacking the budget, leadership and capability to progress smart initiatives and connected technology in cities across the UK.

Avnet Memec and Silica unite

Following the announcement last year, Avnet Memec and Silica have officially formed one company, Avnet Silica. The newly combined business unit will be the European semiconductor specialist division for Avnet, supplying 15,000 customers.

TTI to offer Smiths high rel connectors across Europe

Following a distribution deal, TTI is now offering Smiths Connector’s high reliability connectors featuring Hypertac hyperboloid contact technology across Europe. The agreement is said to build on a successful partnership between Smiths Connectors and TTI France.

European Commission announces amendments to RoHS Directive

The European Commission has published an inception impact assessment signalling its intention to amend the scope of the directive on the restriction of hazardous substances (RoHS) in electrical and electronic equipment. The changes have been made to tackle unintended consequences of the revision of RoHS, also known as RoHS2, published in 2011.

PTC integrates ThingWorx with leading public device clouds

PTC has extended its ThingWorx Internet of Things (IoT) open platform strategy. In addition to offering its own device cloud service, the ThingWorx platform now integrates with Amazon Web Services (AWS) IoT, and will fully support Microsoft Azure IoT Hub in July. PTC is pursuing additional device cloud integrations for ThingWorx, which will allow customers to realise the collective range of services provided by these companies, including the availability of connected device data.

RS signs distribution deal with Intel

RS Components has signed a global agreement with Intel under which it will distribute its computing and embedded development products. Amongst the Intel or Intel based products available from RS are the Edison development platform and the Compute Stick, as well as various devices featuring Atom processor based single board computers and a range of solid state drives with capacities of up to 1.6Tbyte.

Analog Devices acquires SNAP Sensor, enhances IoT sensing portfolio

Analog Devices has acquired SNAP Sensor SA, a Swiss vision sensing company. Analog Devices says the acquisition will help it to build upon platform-level Internet of Things (IoT) solutions such as its Blackfin Low Power Imaging Platform (BLiP), a low-cost, low- power embedded computer vision platform targeting real-time sensing applications.

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