All Business News

Structural electronics specialist gets $23m funding boost

A Finnish developer of injection moulded structural electronics solutions has raised a further $23million in funding from existing and new investors. TactoTek says it will use the funding to expand capacity at its headquarters in Oulu, as well as improving its global engineering and sales presence.

Qualcomm unveils 2Gbit/s LTE modem

Qualcomm Technologies has begun sampling the Qualcomm Snapdragon X24 LTE modem, the first Category 20 LTE modem to be announced that supports download speeds of up to 2Gbit/s. It is also the first-announced chip to be built on a 7nm FinFET process.

Infineon and AMD see strong growth

Infineon Technologies has reported ‘a strong start’ to 2018. According to CEO, Dr Reinhard Ploss, “Earnings and margin were better than forecast – despite the expected slight seasonal dip in revenues.”

ST delivers ‘strong finish’ to 2017 as sales grow by 19.7%

STMicroelectronics has reported that net revenues for its 2017 financial year increased 19.7% to $8.35billion, driven by a 41.4% growth in revenues from its Analog, MEMS and Sensors Group. A significant increase in demand for general purpose MCUs saw revenues from the microcontrollers and digital ICs group (MDG) grow by 15.8% compared to 2016. Strong growth was said to have been seen across all product groups and all regions.

Update on Intel bug

According to a report on the BBC, Intel has stated that the software patches issued to fix security flaws on its chips should not be applied.

Qualcomm gets nod from EC, Korea to buy NXP

While it continues to fight off the unwanted advances of Broadcom, Qualcomm has had approval from the European Commission and the Korea Fair Trade Commission to complete its acquisition of NXP Semiconductors. With eight of nine required approvals, only China has yet to pronounce on the deal.

York EMC changes name, Eurofins buys MET Labs

Following its purchase in 2017 by Eurofins Group, York EMC Services has changed its name to Eurofins York, not only reflecting the new ownership, but also the broader range of regulatory compliance products and services available.

Micron, Intel call time on joint 3D NAND development

Micron and Intel have announced a mutual agreement that, once they complete development of third generation 3D NAND technology towards the end of 2018, they will work independently on future NAND technologies. The move, they claim, will allow them to better optimise the technology and products for their needs.

Xilinx names Peng as president and CEO

Victor Peng has been appointed president and CEO of Xilinx, with effect from 29 January. Peng, currently chief operating officer, is said by Xilinx to be taking over at a time of increasing momentum and opportunity. He takes over from Moshe Gavrielov.

Semi sales soared by 22% over 2016, says Gartner

Sales of semiconductors amounted to $419.7billion in 2017, according to Gartner, which says this is 22.2% higher than in 2016. Undersupply drove a 64% growth in memory revenues and the sector is said by Gartner to account for 31% of all semiconductor revenues in 2017.

Samsung develops 'world's smallest' DRAM chip

Samsung Electronics says it has developed the world’s smallest DRAM chip, in a move that widens its technical lead over its competitors. The move comes as the South Korean giant is expected to announce record operating profits for 2017.

Toshiba, Western Digital settle differences

Toshiba and Western Digital appear to have settled their differences over the sale of Toshiba’s memory unit. The two companies have issued a statement which says they have resolved their ongoing disputes in litigation and arbitration, strengthened and extended their relationship, and enhanced their ongoing flash memory collaboration.

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