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Spring Statement allocates funding to full-fibre broadband projects

Last year's Autumn Budget 2017 saw the launch of a £190million Challenge Fund to help roll out full-fibre to local areas with the aim of providing more reliable broadband to more homes and businesses. Today's Spring Statement has allocated the first wave of funding, providing over £95 million for 13 areas across the UK.

White House blocks Broadcom bid for Qualcomm

US President, Donald Trump, has announced that the US is blocking the Singaporean chip maker Broadcom's bid for the chip manufacturer Qualcomm, citing national security concerns. The move ends what would have been the largest ever tech deal.

Molex investment targets high speed optical interconnect

A strategic investment and collaboration between Molex Optical Solutions Group (OSG) and Elenion Technologies will jointly develop, manufacture and promote silicon photonic-based product solutions. Targeting CMOS technology and high-volume manufacturing processes, the companies intend to develop interconnect solutions that scale to 400Gbit/s and beyond.

Optical interconnect contract signed with 'global tier 1'

Optoscribe, the Livingston based supplier of glass-based integrated photonic components, has signed a multi-million pound procurement agreement to supply transceiver optical interconnect chips to a global Tier 1 optical networking supplier. The chips will be used in photonic integration projects within the data centre interconnect market.

TDK buys ultrasonic sensor pioneer

TDK is buying Chirp Microsystems, a developer of high-performance ultrasonic sensing systems that are said to be smaller than existing devices and to consume less power. Applications for the company’s technology are said to include augmented and virtual reality, as well as smartphones, cars and industrial machinery.

TT Electronics to buy Stadium for £45.8m

Stadium Group is being acquired by TT Electronics in a £45.8million deal. According to TT, the move will position the enlarged business as an increasingly product-focused provider of differentiated solutions for its global customers.

Structural electronics specialist gets $23m funding boost

A Finnish developer of injection moulded structural electronics solutions has raised a further $23million in funding from existing and new investors. TactoTek says it will use the funding to expand capacity at its headquarters in Oulu, as well as improving its global engineering and sales presence.

Qualcomm unveils 2Gbit/s LTE modem

Qualcomm Technologies has begun sampling the Qualcomm Snapdragon X24 LTE modem, the first Category 20 LTE modem to be announced that supports download speeds of up to 2Gbit/s. It is also the first-announced chip to be built on a 7nm FinFET process.

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