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Stacks of memory
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12/12/2006
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NEC Electronics, along with Elpida Memory and Oki Electric, has developed a packaging technology that it says will allow mobile phones and other portable devices to be equipped with as much memory as a high performance computer.
The new technology places eight memory dice and one controller chip in a vertical stack, with 3d connections between them. This arrangement is said to provide enough memory for high definition video and high speed 3d graphics applications in a package slim enough for cell phones and portable game players.
The key feature of the approach is the way in which the chips are connected in the stack. Each chip has more than 1000 pins on each side and these are connected to polysilicon electrodes built into the chips themselves. These electrodes pierce the chips vertically from top to bottom. The chips are then connected by high density microbumps spaced 50µm apart. The entire package, including the controller chip, is compact because each memory die is only 50µm thick.
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Author
Graham Pitcher
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