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COM Express small form factor module based on latest Intel Core i7 processor
April 2010 Email to a friend
 
Congatec has extended its COM Express product family with the highest performance module conga-BM57.

COM Express small form factor module based on latest Intel Core i7 processorIt features the latest Intel Core i7-620M processor with a core speed of 2.66GHz, with 4MByte L2 cache and up to 8GByte fast (1066 MT/s) dual channel ddr3 memory.

The conga BM57 is a two chip solution which utilises the Mobile Intel QM57 Express Chipset. The integrated graphics controller is supporting the Intel Flexible Display Interface (FDI) in order to allow for two independent video channels on VGA, LVDS, HDMI, DisplayPort or SDVO interfaces.

According to congatec, the major highlight of the COM Express Basic (95x125mm) module with type 2 connector pin out is the boosted graphics performance. The 3D performance was increased substantially over the last generation of Intel integrated graphics.

Paired with the additional computing performance of the Intel Core i7 processor the conga-BM57 enables intense graphics applications which are often found in gaming or medical image applications.

The implemented Intel Turbo Boost Technology provides an on demand boost in the clock speed for one processor core if the other core is less utilised. This new feature improves the computing performance by as much as 25% - as measured by congatec during benchmark testing.

In order to keep the power consumption at about the same level as the predecessor generation, the Intel Core i7 processor supports new power management states. The C6 state, already known from Intel Core processors, saves the architectural state to a dedicated sram. Then the cores can be switched off to reduce the current to almost zero. The independence of the C6 states for each core boasts even greater power savings for the platform.

Five PCI Express lanes, eight USB 2.0 ports, three SATA, one EIDE and a Gigabit Ethernet interface allow for fast and flexible system extensions. Fan control, LPC bus for slow speed extensions and Intel High Definition Audio complete the feature set.

First public live demos of the conga-BM57 will be shown at the International Gaming Expo in London, Jan 26-28, 2010.
 
Author
Chris Shaw
 
 
Supporting Information
http://www.congatec.com
http://www.intel.com/go/eca
 
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