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05/11/2009
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Infineon and TSMC are extending their development and production partnership to encompass a 65nm embedded flash process targeted at next generation automotive, chip card and security applications. The partnership is said by Infineon to be in line with its strategy to outsource manufacturing and to engage in technology codevelopment for 65nm and smaller geometry processes.
 "We are pleased to extend our collaboration with TSMC as a stable and reliable partner into new applications," explained Jochen Hanebeck, president of Infineon's Automotive Division. "We are confident that TSMC … will be able to fulfill the stringent automotive market requirements with its particular focus on quality."
The 65nm eFlash technology for automotive applications supports the high degree of functional integration required that drive the performance and features called for in upcoming safety and emission standards. Meanwhile, The 65nm eFlash technology for chip card and security applications will support Infineon's focus on tailored security that offers the appropriate level of security at the best cost performance ratio, for applications in the smart card form factor and beyond.
Process and product qualification for security mcus is scheduled for the second half of 2012, while the automotive mcu is scheduled for qualification and production in the first half of 2013. Infineon's 32bit TriCore mcus will be the first automotive products produced on the 65nm eFlash process. Ultimately, TSMC will manufacture Infineon's broad range of security microcontrollers that feature contact-based, contact-less or dual interface.
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Author
Graham Pitcher
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