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June 2009
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Packaging specialist Schroff has launched a compact MicroTCA system which it says can accommodate up to six single mid size AdvancedMC modules in a 19in enclosure with a height of 1U.
 The 1U MicroTCA system features a case design said to ensure efficient cooling of the modules and is suitable for use in high performance multiprocessor systems where rack space may be limited, such as industrial or transportation applications.
The system has six slots for horizontal mounting of the AdvancedMC modules, as well as a dedicated slot for a MicroTCA carrier hub. In addition, the 1U system is equipped with a special MicroTCA backplane, a built-in power supply and a hot-swap capable fan tray.
The topology of the MicroTCA backplane has been designed to allow simultaneous use of different software protocols, and all AdvancedMC slots are compatible with PICMG AMC.0 R2.0, the Advanced Mezzanine Card base specification.
With a depth of 350mm, the 1U system includes a 250WAC power supply unit behind the backplane, with a MicroTCA compatible power management module in the form of a mezzanine board mounted on the rear of the backplane.
Cooling is achieved by the temperature controlled fan tray, combined with the triangular design of the side vents, which Schroff says increases the effective air inlet and exhaust volumes by 30%.
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Author
Chris Shaw
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