Home Advertise Magazine Events NETV Directory
  


Composite has ‘superior’ conductivity to copper
07/04/2009 Email to a friend
 
Electronics researchers have discovered a new composite that they claim surpasses the high thermal conductivity of copper.

Keeping the heat downThe material has been developed in a bid to deal with industrial applications where heat in devices with densely packed components needs to be dispersed evenly. The research was undertaken by the Fraunhofer Institute for Manufacturing Engineering and Applied Materials Research IFAM, together with industrial partners including Siemens and Plansee as part of an EU project "ExtreMat".
IFAM's project manager, Dr Thomas Schunert revealed: "The resulting material expands no more than ceramics when heated, but has a conductivity one and a half times superior to copper. This is a unique combination of properties."
Because of the difficulty of uniting copper and diamond, a third ingredient was required to chemically bond the materials. Schubert explained: "One ingredient we can use to achieve this is chrome. Even small amounts form a carbide film on the diamond serfuce and this film easily bonds to copper.
The material could eventually replace traditional small copper or aluminium plates mounted underneath components to conduct heat away.
 
Author
Chris Shaw
 
 
Supporting Information
http://www.alphagalileo.org/ViewItem.aspx?ItemId=56770&Cultu...
 
This material is protected by Findlay Media copyright 2010.
See Terms and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the sales team.
 
Bookmark this article using:
 
Del.icio.us digg reddit Facebook StumbleUpon
 
 
Your comments / feedback
Do you have any comments or feedback on this article? Please contact us by filling in the form below.
NameHide name
Your Email Address
Comments
Send
We may edit your comments and not all entries will be published.
Terms and Conditions

To comment on news stories or blogs you need to complete our 60 second registration process. Once completed this then allows you to download any and all white papers, register for e-zines and access our detailed supplier directory for FREE.

If you are all ready a registered user then enter your e-mail address and login.

You will need to have logged in prior to entering your comments in the boxes provided.

Please enter your email address to login and gain free access to this site.
 
If you are using this site for the first time registration is quick and completely free.
 
Register Now - Register Now


Email Address :  

Remember Me: - If this box is ticked you will be automatically logged in when you return.

Important: To protect your privacy, do not select 'Remember Me' if other users have access to the computer you are using.

 
Related Companies
Fraunhofer Institute IFAM
 
Siemens PLM
 
 
Related News
Energy Micro nets $13million investment
 
OEM, EMS semi spend to rise significantly in 2010
 
Bloodhound Project set to stay on track
 
Graphene could store hydrogen safely in fuel cell applications
 
Renesas Electronics structure announced
 
 
Related Technology
Core to the fore
 
From little acorns
 
Hive mentality: Microrobots
 
Putting pieces together
 
On a charge: Automotive electronics
 
 
Related Products
Interconnection solutions for industry
 
Switched mode power supply for CompactPCI applications
 
Industrial displays with 7in diagonal screen and LED backlighting
 
Low power motherboard
 
Hypertac M12 interconnect system from Aerco
 
 
Related Events
Transistors on Plastic
 
Printed electronics Europe 2010
 
International Electronics Forum 2010
 
ARM and the future of microcontrollers