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10/03/2009
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IMEC and its associated laboratory at Ghent University have unveiled a 3D integration process that is said to enable flexible electronic systems with a thickness of less than 60um.
 The technology, which will allow complete systems to be integrated in a conventional low cost flex substrate, is likely to pave the way to low cost wearable electronics.
In the process, the chip is first thinned to 25um and embedded in a flexible chip package. Next, the package is embedded in a standard double layer flex pcb using standard techniques. After embedding, other components can be mounted above and below the embedded chip.
IMEC hase demonstrated the approach using a prototype flexible wireless monitor that measures heart rate and muscle activity. The system consists of an embedded ultra thin chip for the microcontroller and a/d converter, an ultra low power biopotential amplifier chip and a radio transceiver. By thinning the chips, they become mechanically flexible, bringing increased flexibility to the system.
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Author
Graham Pitcher
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