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02/03/2009
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Intel and TSMC have signed a Memorandum Of Understanding under which they will collaborate on technology platform, IP infrastructure, and SoC solutions. Under the terms of the agreement, Intel will port its Atom processor cpu cores to the TSMC technology platform including processes, IP, libraries, and design flows.
 According to Intel, the collaboration is intended to expand the availability of Atom SoCs to a wider range of applications through integration with TSMC’s diverse IP infrastructure.
“We believe this effort will make it easier for customers with significant design expertise to take advantage of benefits of the Intel architecture in a manner that allows them to customise the implementation precisely to their needs,” said Paul Otellini, Intel president and CEO. “The combination of the compelling benefits of our Atom processor, combined with the experience and technology of TSMC, is another step in our long term strategic relationship.”
“TSMC values our strategic relationship with Intel,” said Dr Rick Tsai, TSMC’s president and ceo. “This agreement brings together the Intel architecture and the TSMC technology platform. We expect this collaboration will help proliferate the Atom processor SoC and foster overall semiconductor growth.”
Malcolm Penn, chairman of Future Horizons, noted: “Intel has shown the gutsy single mindedness needed to win new chip markets and it has simultaneously not shirked the hard fact that its cost and marketing structure couldn’t compete. These are the sort of no nonsense ‘just do it’ decisions that helped make the chip industry – and, in particular, Intel and TSMC – great. It has powerfully raised the competitive stakes in the digital consumer electronics market.”
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Author
Graham Pitcher
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