Home Advertise Magazine Events NETV Directory
  


Pushing nanotechnology to the limit
20/02/2009 Email to a friend
 
Two US research teams are taking nanotechnology to the limit, with one developing transistors a fraction of the size of those used on chips and another working on a film material capable of storing data from 250 dvds onto a surface the size of a coin.

Pushing nanotechnology to the limit
Jeremy Levy from the University of Pittsburgh explained: “We have demonstrated that we can make important technologies that are significantly smaller than existing devices.”
Levy’s team created its nanotech transistors using two ceramic crystal materials – lanthanum aluminate and strontium titanate. When sandwiched together, the insulators conduct electricity when a positive charge is passed across them. Using the tip of an atomic force microscope, a voltage was applied to etch a tiny conducting wire between the two materials, which can later be erased by reversing the charge. According to Levy, the transistor is the smallest ever produced and the same materials can be used to make atom sized transistors for computers, memory devices and sensors.
A thin semiconductor film has also been developed by researchers from the University of Massachusetts Amherts and the University of California Berkely. Although polymers have been used before when creating sheets, the material can lose its structure when spread over large surfaces. The new method involves heating sapphire crystals to create a specific pattern of ridges on a surface. This serves as a guide for the semiconductor film. The technology could result in arrays of semiconductor material that are almost 15 times denser than anything achieved previously.
 
Author
Chris Shaw
 
 
Supporting Information
http://www.reuters.com/article/technologyNews/idUSTRE51I5PP2...
 
This material is protected by Findlay Media copyright 2010.
See Terms and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the sales team.
 
Bookmark this article using:
 
Del.icio.us digg reddit Facebook StumbleUpon
 
 
Your comments / feedback
Do you have any comments or feedback on this article? Please contact us by filling in the form below.
NameHide name
Your Email Address
Comments
Send
We may edit your comments and not all entries will be published.
Terms and Conditions

To comment on news stories or blogs you need to complete our 60 second registration process. Once completed this then allows you to download any and all white papers, register for e-zines and access our detailed supplier directory for FREE.

If you are all ready a registered user then enter your e-mail address and login.

You will need to have logged in prior to entering your comments in the boxes provided.

Please enter your email address to login and gain free access to this site.
 
If you are using this site for the first time registration is quick and completely free.
 
Register Now - Register Now


Email Address :  

Remember Me: - If this box is ticked you will be automatically logged in when you return.

Important: To protect your privacy, do not select 'Remember Me' if other users have access to the computer you are using.

 
Related News
BEEAs 2010 shortlist announced
 
GlobalFoundries aims for high volume 28nm manufacturing
 
HP and Hynix collaborate to bring memristor technology to market
 
TI completes acquisition of Spansion Japan wafer fab facility
 
Glasgow spin out tackles variability in next generation chip design
 
 
Related Technology
Converting expectations
 
The world in your hand
 
A tale of two cities - UK Electronics England
 
Flower of Scotland - UK Electronics Scotland
 
Reinvigoration in process - UK Electronics Ireland
 
 
Related Products
ROLEC aluCASE - Modern IP67 Diecast Aluminium Enclosures: Sponsored by ROLEC
 
IBM tackles 22nm challenges
 
 
Related Events
The Future World Symposium
 
British Engineering Excellence Awards
 
Electronic and Electrical Design Conference 2010