For some years, electronic system manufacturing in the UK has been characterised by high value and high mix, low volume contracts. Smaller volumes and smaller components incorporated on complex, highly integrated boards, have led to fundamental changes in the way such boards are tested.
Traditional methods, such as large automated test equipment (ATE) and bed of nails testers, become less economically viable and effective as test access becomes more challenging. But with no manufacturing process 100% perfect, test remains as vital to the manufacturing process as ever. So how are ems/cems adapting and what test technologies and strategies are they adopting?
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