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17/09/2008
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Finnish embedded packaging developer Imbera has licensed its integrated module board (IMB) technology to Ibiden, the world’s largest pcb producer. The technology is set to allow Ibiden to offer a product miniaturisation service.
Imbera ceo Jeff Baloun noted: “Partnering with the number one pcb house in the world is great kudos for Imbera and proves to the industry how well our technology works in a production setting.”
IMB technology allows components to be embedded inside a pcb’s core layer. According to chief technology officer Risto Tuominen, it is possible to embed almost any kind of component, including bare dice and wafer level chip scale packages. “It uses space that hasn’t been used before,” he claimed, “and that allows size reduction and product miniaturisation.”
Tuominen said the approach uses standard pcb manufacturing processes and can also include thermal vias. “Our approach can offer better thermal performance than a standard bga package.”
IMB can be used as a component miniaturisation technology, where multiple dice can be accommodated in a smaller package, or to house components in pcbs. “The technology allows up to 100 passive components to be embedded in a pc,” he noted, “providing designers with more board space.”
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Author
Graham Pitcher
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