|
|
|
|
|
17/09/2008
 Email to a friend
|
| |
Finnish embedded packaging developer Imbera has licensed its integrated module board (IMB) technology to Ibiden, the world’s largest pcb producer. The technology is set to allow Ibiden to offer a product miniaturisation service.
Imbera ceo Jeff Baloun noted: “Partnering with the number one pcb house in the world is great kudos for Imbera and proves to the industry how well our technology works in a production setting.”
IMB technology allows components to be embedded inside a pcb’s core layer. According to chief technology officer Risto Tuominen, it is possible to embed almost any kind of component, including bare dice and wafer level chip scale packages. “It uses space that hasn’t been used before,” he claimed, “and that allows size reduction and product miniaturisation.”
Tuominen said the approach uses standard pcb manufacturing processes and can also include thermal vias. “Our approach can offer better thermal performance than a standard bga package.”
IMB can be used as a component miniaturisation technology, where multiple dice can be accommodated in a smaller package, or to house components in pcbs. “The technology allows up to 100 passive components to be embedded in a pc,” he noted, “providing designers with more board space.”
|
|
| |
Author
Graham Pitcher
|
| |
| |
|
| |
This material is protected by Findlay Media copyright 2010.
See Terms and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the sales team.
|
| |
|
|
| |
To comment on news stories or blogs you need to complete our 60 second registration process. Once completed this then allows you to download any and all white papers, register for e-zines and access our detailed supplier directory for FREE.
If you are all ready a registered user then enter your e-mail address and login.
You will need to have logged in prior to entering your comments in the boxes provided.
|