Home Advertise Magazine Events NETV Directory
  


Packaging progress
07/08/2008 Email to a friend
 
STMicroelectronics, STATS ChipPAC and Infineon Technologies are partnering to develop the next generation of embedded wafer level ball grid array (eWLB) technology.

Packaging progress
Introduced last year by Infineon, eWLB technology uses a combination of traditional ‘front end’ and ‘back end’ semiconductor manufacturing techniques with parallel processing of all the chips on the wafer, leading to reduced manufacturing costs.
According to the partners, increased levels of integration and a significantly higher number of external contacts means the technology can provide cost and size benefits in wireless and consumer product applications.
ST’s decision to work with Infineon to jointly develop and use eWLB technology is said to be an important milestone for the approach and to boost its chances of becoming an industry standard.
ST plans to use the technology in several products from its ST-NXP Wireless joint venture and in other application markets. “The technology is an excellent complement for our next generation products, especially in wireless applications,” stated Carlo Cognetti, director of advanced packaging technology for ST. “The technology sets new milestones in innovation, cost competitiveness and dimensions and we believe that, together with Infineon, we will pave the way to a new powerful package technology platform.”
 
Author
Graham Pitcher
 
 
Supporting Information
http://www.infineon.com
http://www.st.com
http://www.statschippac.com
 
This material is protected by Findlay Media copyright 2010.
See Terms and Conditions.
One-off usage is permitted but bulk copying is not.
For multiple copies contact the sales team.
 
Bookmark this article using:
 
Del.icio.us digg reddit Facebook StumbleUpon
 
 
Your comments / feedback
Do you have any comments or feedback on this article? Please contact us by filling in the form below.
NameHide name
Your Email Address
Comments
Send
We may edit your comments and not all entries will be published.
Terms and Conditions

To comment on news stories or blogs you need to complete our 60 second registration process. Once completed this then allows you to download any and all white papers, register for e-zines and access our detailed supplier directory for FREE.

If you are all ready a registered user then enter your e-mail address and login.

You will need to have logged in prior to entering your comments in the boxes provided.

Please enter your email address to login and gain free access to this site.
 
If you are using this site for the first time registration is quick and completely free.
 
Register Now - Register Now


Email Address :  

Remember Me: - If this box is ticked you will be automatically logged in when you return.

Important: To protect your privacy, do not select 'Remember Me' if other users have access to the computer you are using.

 
Related Companies
ST Microelectronics Ltd
 
STATS ChipPac Ltd
 
Infineon Technologies AG
 
 
Related News
BEEAs 2010 shortlist announced
 
GlobalFoundries aims for high volume 28nm manufacturing
 
HP and Hynix collaborate to bring memristor technology to market
 
Integrated graphics microprocessors take over notebook pc market
 
Glasgow spin out tackles variability in next generation chip design
 
 
Related Technology
The world in your hand
 
A tale of two cities - UK Electronics England
 
Flower of Scotland - UK Electronics Scotland
 
In good shape - UK Electronics Overview
 
Making a difference - UK Electronics Skills
 
 
Related Products
Multichannel rf remote control application board
 
High-current 200A crimp module joins modular connector family
 
Sponsored by RS Components: DesignSpark PCB, a free professional standard PCB design software tool
 
HiFi audio dsp first ip core approved for Dolby MS10 multistream decoder
 
PEAK 777VL2 single board computer
 
 
Related Events
Supporting the Delivery of Safety: Services to help you achieve and assure safety – A seminar and exhibition.
 
Windows Embedded Standard 7 Workshop
 
EMCUK
 
UKEA Anti Counterfeiting Forum
 
British Engineering Excellence Awards