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Ahead of the pack
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20/06/2008
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During the creation of an integrated circuit, the initial focus is naturally on the design. When it comes to tape out and fabrication, multiproject wafer (MPW) services are growing in popularity as deep submicron technologies become the norm and mask and wafer fabrication costs soar.
However, device packaging is often overlooked until the end of process. This may be due to some fabs and MPW providers having relatively little to offer with respect to packaging, or it may be simply that packaging is seen as the last thing that designers need to worry about. In fact, choosing the right package – during the creation of a chip, the development test phase and final device – can not only reduce time to market, but also help to create tangible benefits for customers.
The choice of packages has never been greater and some MPW providers now recognise the importance of providing optimised packages throughout the silicon device development process. Most frequently, this is done through partnering with established packaging specialists.
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Author
Wes Hansford
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