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Qimonda, Elpida share dram technology
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24/04/2008
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Qimonda and Elpida Memory are forming technology partnership to jointly develop drams. The partnership agreement will see Qimonda contributing its Buried Wordline technology, whilst Elpida will provide its advanced stack capacitor technology.
The strategic technology cooperation is planned to accelerate both companies’ dram roadmap for devices will cell sizes of 4F², where F is the feature size (40nm for example). They plan to introduce the 4F² cell concept on a 40nm process in 2010 and to scale it to a 30nm node.
“This strategic cooperation with Elpida is a tremendous endorsement of our innovative Buried Wordline technology,” said Kin Wah Loh, pictured, Qimonda’s president and ceo. “Qimonda will leverage this partnership to significantly accelerate the introduction of small 4F² cell sizes.”
Meanwhile, Elpida’s president and ceo Yukio Sakamoto added: “In the tough, competitive industry that we are in, faster and more efficient development of new process technologies is becoming critically important. We believe this joint development agreement with Qimonda will further accelerate and strengthen our technology leadership.”
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Author
Graham Pitcher
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