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IMEC tapes out flexible air interface 11/02/2008
 
IMEC says it has completed the design and tape out of a flexible air interface (FLAI) baseband platform for software defined radios and says its solution will provide a basis for support of future mobile devices featuring standards such as IEEE802.11n, IEEE802.16e, mobile TV and 3GPP-LTE.
The FLAI platform incorporates two IMEC proprietary ADRES (architecture for dynamically reconfigurable embedded systems) baseband processors, three digital front end tiles with a proprietary ASIP (application specific integrated
processor) to assure sync detection, an ARM9 processor and optimised AMBA interconnect to link the SoC’s modules with on chip memories.
The IP blocks come with reference platform control software and reference firmware for 802.11n, 802.16e and 3GPP-LTE, as well as integration support.
IMEC says the SoC consumes only a few milliwatts in standby mode, yet is still capable of receiving an immediate burst from any supported wireless standard. When transmitting or receiving data bursts with multi antenna encoding at more than 100Mbit/s, peak power consumption is 300mW.
 
Author
Graham Pitcher
 
 
Supporting Information
 
 http://www.imec.be
 
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