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Extreme ultraviolet lithography collaboration
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22/01/2008
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The College of Nanoscale Science and Engineering at the University at Albany and IMEC have announced plans to accelerate research and development of extreme ultraviolet lithography. The collaboration will also involve scientists from IBM and ASML.
The collaboration between CNSE, IMEC, IBM and ASML is expected to further advance the learning on EUVL technology and the associated infrastructure required to support it. Ultimately, this alliance is intended to effectively demonstrate the practical feasibility of EUVL and build confidence in the technology for the 32nm half pitch device node and below.
Luc Van den hove, IMEC’s chief operating officer (pictured), said: “EUV lithography is a promising solution to further scale cmos beyond the 32nm node, but major challenges still need to be overcome. We look forward to building a great partnership with the UAlbany NanoCollege to advance the state of the art in nanoscale lithography.”
The first set of collaborative experiments will be carried out at CNSE’s Albany NanoTech Complex, with future joint studies to be conducted at CNSE and IMEC, depending on throughput and/or availability of the tools.
Most of the research will focus on the advanced imaging capabilities of the EUVL system, with additional effort devoted to the understanding of new materials and various aspects of equipment technology.
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Author
Graham Pitcher
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