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Packed and stacked
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07/12/2007
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Packaging is the final step in the complex process of turning silicon into a useful semiconductor device. As in most electronics, the trend is to make semiconductor devices smaller, yet more powerful. Freescale says this evolution can be traced through three types of packaging technologies: system in package (SiP), package on package (PoP) and, now, redistributed chip packaging (RCP).
Redistributed chip packaging sets out to increase speeds and reduce package sizes inside high interconnected semiconductor devices such as mobile phones, pdas and multimedia players. This technology enables manufacturers to create the kind of small, sleek multifunctional devices that customers demand into a smaller, more cost effective and highly integrated solutions.
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Author
Mike Richardson
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