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TSMC ships 1million 12in 90nm wafers
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03/12/2007
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TSMC says it has shipped 1million 12inch 90nm wafers in record time. According to the company, it has taken just 53 months to break through the 1million wafer barrier, five months quicker than it achieved with its 0.13µm process.
TSMC vice president, corporate development, Jason Chen credits the fast ramp of 90nm process to a number of factors, including a comprehensive IP and library portfolio and an accelerated yield learning curve.
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Author
Graham Pitcher
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