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NEC targets 40nm at Yamagata
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16/11/2007
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NEC Electronics is spending Y10billion (£44million) this year on an immersion lithography system and other production equipment to support 40 and 55nm manufacturing at its Yamagata plant in Japan.
Sampling of 55nm products started in October and the company plans to move to 40nm production by early 2009. Amongst the first 40nm devices will be advanced lsi chips and asics with embedded memory.
According to NEC, it has invested Y140bn (£620m) since 300mm wafer production started at the site, moving production from the initial 130nm technology.
The latest investment will upgrade the Yamagata 300mm line to support production of up to 5000 wafers per month using 55nm technology. Of these, approximately 2000 wafers per month can be adapted for 40nm production.
The plant’s throughput will remain at 13,000 wafers per month and it will continue to support 130 and 90nm production.
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Author
Graham Pitcher
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