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01/11/2007
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STMicroelectronics and US company Automotive Communications Systems are to jointly develop communications ics for vehicle and infrastructure integration (VII) applications. The VII initiative is investigating the potential safety benefits of car to car and car to roadside high speed communications.
“There is clearly enormous potential for the technology that ACS brings to solving problems facing the VII program,” said Ugo Carena, general manager of ST’s automotive products group, pictured. “Our capability in automotive, wireless communication and location, coupled with ACS’ technology will provide significant advantages to the government, auto companies, and their suppliers.”
“We are excited to be working with … STMicroelectronics,” said Milt Baker, ceo of ACS. “The synergy of our technology, along with ST’s technology and products, will be a key contributor to VII.”
ACS has patent pending technology which addresses a number of VII challenges, including providing the statistically determinant channel access necessary for safety systems, providing robust communications in a multipath environment and providing precision vehicle location (within 30cm).
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Author
Graham Pitcher
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